XC95288XV-6FG256C
XC95288XV-6FG256C
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rohs
Xilinx

XC95288XV-6FG256C


XC95288XV-6FG256C
F20-XC95288XV-6FG256C
Active
FLASH PLD, 6 ns, 288-Cell, CMOS, PLASTIC, FBGA-256
PLASTIC, FBGA-256

XC95288XV-6FG256C ECAD Model


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XC95288XV-6FG256C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 6 ns
Number of Macro Cells 288
Number of I/O Lines 192
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 192 I/O
Additional Feature YES
Clock Frequency-Max 208 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.8/3.3,2.5 V
Supply Voltage-Max 2.62 V
Supply Voltage-Min 2.37 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC95288XV-6FG256C Datasheet Download


XC95288XV-6FG256C Overview



The XC95288XV-6FG256C chip model is a high-performance, low-cost programmable logic device designed for a variety of industrial applications. It is the latest in a line of Xilinx FPGA products designed to offer maximum flexibility and scalability. This chip model is ideal for applications that require high performance, low power consumption, and cost-effectiveness.


The XC95288XV-6FG256C chip model offers a variety of advantages, including a high-speed, low-power design, a wide range of programmable logic functions, and an array of I/O options. It also offers a variety of advanced features, such as a high-performance, low-power processor core, a large memory array, and an array of I/O options. These features make the XC95288XV-6FG256C an ideal choice for industrial applications.


The XC95288XV-6FG256C chip model is expected to be in high demand in the future, due to its versatility and scalability. It can be used for a variety of applications, including industrial automation, automotive, aerospace, and medical electronics. In addition, its low power consumption and cost-effectiveness make it an attractive option for many industries.


The original design intention of the XC95288XV-6FG256C chip model was to provide a low-cost, high-performance FPGA solution for a variety of industrial applications. It was designed with a wide range of programmable logic functions, an array of I/O options, and a high-performance processor core. The chip model was also designed to be upgradable, allowing users to customize the device to their specific needs.


The XC95288XV-6FG256C chip model can be applied to a variety of advanced communication systems. It can be used for high-speed data transmission, digital signal processing, and wireless communications. Its low power consumption and cost-effectiveness make it an attractive option for many industries.


When designing a system with the XC95288XV-6FG256C chip model, there are a few important considerations. First, the chip model must be configured correctly to ensure the desired performance. Second, the power requirements of the system must be taken into account, as the chip model is designed to operate at low power levels. Finally, the system must be tested thoroughly to ensure that it meets all of the design requirements.


In conclusion, the XC95288XV-6FG256C chip model is a high-performance, low-cost programmable logic device designed for a variety of industrial applications. It offers a variety of advantages, including a high-speed, low-power design, a wide range of programmable logic functions, and an array of I/O options. It is expected to be in high demand in the future, due to its versatility and scalability. The chip model can be applied to a variety of advanced communication systems, and it can be customized to meet specific design requirements. When designing a system with the XC95288XV-6FG256C chip model, it is important to consider the power requirements and to thoroughly test the system to ensure that it meets all of the design requirements.



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