XCS30-3BG256C
XCS30-3BG256C ECAD Model
XCS30-3BG256C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Spartan® | |
Package | Tray | |
Number of LABs/CLBs | 576 | |
Number of Logic Elements/Cells | 1368 | |
Total RAM Bits | 18432 | |
Number of I/O | 192 | |
Number of Gates | 30000 | |
Voltage - Supply | 4.75V ~ 5.25V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 256-BBGA | |
Supplier Device Package | 256-PBGA (27x27) | |
Base Product Number | XCS30 |
XCS30-3BG256C Datasheet Download
XCS30-3BG256C Overview
The XCS30-3BG256C is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is designed to be used in a variety of applications, including digital signal processing, embedded systems, and communications. This chip is based on the Spartan-3E architecture and is built on a 0.13-micron process.
The XCS30-3BG256C has a total of 256 logic cells, each with 4-input lookup tables, flip-flops, and multiplexers. It also has 32Kbits of Block RAM, and 8Kbits of distributed RAM. The chip also has up to 4 dedicated clock resources, which can be used to generate up to 4 separate clock signals. It also contains 4 dedicated clock resources for phase-locked loops, which can be used to generate high-frequency clock signals.
The XCS30-3BG256C has a maximum operating frequency of up to 200 MHz. It has a total of 256 user I/O pins, which can be configured for a variety of I/O standards, such as LVTTL, LVCMOS, and HSTL. The chip also has a power consumption of 1.5 W.
The XCS30-3BG256C is suitable for a variety of applications, such as digital signal processing, embedded systems, and communications. It can be used for applications such as video processing, image processing, audio processing, and control systems. It can also be used for high-speed communication systems, such as Ethernet, Fiber Channel, and InfiniBand.
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Pricing (USD)
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