XCS30-3BG256C
XCS30-3BG256C
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Xilinx

XCS30-3BG256C


XCS30-3BG256C
F20-XCS30-3BG256C
Active
IC FPGA 192 I/O 256BGA
256-PBGA (27x27)

XCS30-3BG256C ECAD Model


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XCS30-3BG256C Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®
Package Tray
Number of LABs/CLBs 576
Number of Logic Elements/Cells 1368
Total RAM Bits 18432
Number of I/O 192
Number of Gates 30000
Voltage - Supply 4.75V ~ 5.25V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BBGA
Supplier Device Package 256-PBGA (27x27)
Base Product Number XCS30

XCS30-3BG256C Datasheet Download


XCS30-3BG256C Overview



The XCS30-3BG256C is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is designed to be used in a variety of applications, including digital signal processing, embedded systems, and communications. This chip is based on the Spartan-3E architecture and is built on a 0.13-micron process.


The XCS30-3BG256C has a total of 256 logic cells, each with 4-input lookup tables, flip-flops, and multiplexers. It also has 32Kbits of Block RAM, and 8Kbits of distributed RAM. The chip also has up to 4 dedicated clock resources, which can be used to generate up to 4 separate clock signals. It also contains 4 dedicated clock resources for phase-locked loops, which can be used to generate high-frequency clock signals.


The XCS30-3BG256C has a maximum operating frequency of up to 200 MHz. It has a total of 256 user I/O pins, which can be configured for a variety of I/O standards, such as LVTTL, LVCMOS, and HSTL. The chip also has a power consumption of 1.5 W.


The XCS30-3BG256C is suitable for a variety of applications, such as digital signal processing, embedded systems, and communications. It can be used for applications such as video processing, image processing, audio processing, and control systems. It can also be used for high-speed communication systems, such as Ethernet, Fiber Channel, and InfiniBand.



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