XCV50-6BG256C
XCV50-6BG256C
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Xilinx

XCV50-6BG256C


XCV50-6BG256C
F20-XCV50-6BG256C
Active
IC FPGA 180 I/O 256BGA
256-PBGA (27x27)

XCV50-6BG256C ECAD Model


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XCV50-6BG256C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 384
Number of Logic Elements/Cells 1728
Total RAM Bits 32768
Number of I/O 180
Number of Gates 57906
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BBGA
Supplier Device Package 256-PBGA (27x27)
Base Product Number XCV50

XCV50-6BG256C Datasheet Download


XCV50-6BG256C Overview



The XCV50-6BG256C is a high-performance, low-power, low-cost FPGA chip. It is designed to meet the needs of a variety of applications, including embedded systems, digital signal processing, communications, and networking.


The XCV50-6BG256C is based on the Xilinx Virtex-5 FPGA architecture, which provides a high-performance, low-cost solution for a wide range of applications. The chip has 256K logic cells, 2,048 DSP slices, and up to 6.5Mbits of block RAM. It also includes a number of advanced features, such as a high-speed differential I/O, advanced power management, and a wide range of I/O options.


The XCV50-6BG256C is ideal for a wide range of applications, including embedded systems, digital signal processing, communications, and networking. It provides a high-performance, low-cost solution for a wide range of applications. It is also suitable for high-speed, low-power applications, such as wireless networks and high-speed data transfer.


The XCV50-6BG256C is a high-performance, low-cost FPGA chip that is designed to meet the needs of a variety of applications. It provides a high-performance, low-cost solution for a wide range of applications, including embedded systems, digital signal processing, communications, and networking. It is also suitable for high-speed, low-power applications, such as wireless networks and high-speed data transfer.



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