XCV400E-6FG676C
XCV400E-6FG676C ECAD Model
XCV400E-6FG676C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-E | |
Package | Tray | |
Number of LABs/CLBs | 2400 | |
Number of Logic Elements/Cells | 10800 | |
Total RAM Bits | 163840 | |
Number of I/O | 404 | |
Number of Gates | 569952 | |
Voltage - Supply | 1.71V ~ 1.89V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Base Product Number | XCV400E |
XCV400E-6FG676C Datasheet Download
XCV400E-6FG676C Overview
The XCV400E-6FG676C is a field programmable gate array (FPGA) chip manufactured by Xilinx. It is a mid-range FPGA device with a capacity of 400K system gates and 6,000 logic cells. It has a power consumption of 1.2 watts and is packaged in a 676-pin Flip-Chip Ball Grid Array (FCBGA).
The XCV400E-6FG676C chip has a wide range of features, including high-speed transceivers, built-in memory, dedicated multipliers and DSP blocks, and a variety of I/O options. It also includes a number of features that facilitate programming, such as a JTAG port and an integrated configuration device.
The XCV400E-6FG676C is suitable for a wide range of applications, such as medical imaging, industrial automation, digital signal processing, and embedded systems. It is also suitable for use in high-speed communications, such as Ethernet and USB.
In summary, the XCV400E-6FG676C is a mid-range FPGA chip with a wide range of features and suitable for a variety of applications. It has a capacity of 400K system gates and 6,000 logic cells, a power consumption of 1.2 watts, and is packaged in a 676-pin FCBGA. It includes features such as high-speed transceivers, built-in memory, dedicated multipliers and DSP blocks, and a variety of I/O options, and is suitable for use in medical imaging, industrial automation, digital signal processing, embedded systems, and high-speed communications.
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