XCV400E-6FG676C
XCV400E-6FG676C
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Xilinx

XCV400E-6FG676C


XCV400E-6FG676C
F20-XCV400E-6FG676C
Active
IC FPGA 404 I/O 676FCBGA
676-FBGA (27x27)

XCV400E-6FG676C ECAD Model


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XCV400E-6FG676C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 2400
Number of Logic Elements/Cells 10800
Total RAM Bits 163840
Number of I/O 404
Number of Gates 569952
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XCV400E

XCV400E-6FG676C Datasheet Download


XCV400E-6FG676C Overview



The XCV400E-6FG676C is a field programmable gate array (FPGA) chip manufactured by Xilinx. It is a mid-range FPGA device with a capacity of 400K system gates and 6,000 logic cells. It has a power consumption of 1.2 watts and is packaged in a 676-pin Flip-Chip Ball Grid Array (FCBGA).


The XCV400E-6FG676C chip has a wide range of features, including high-speed transceivers, built-in memory, dedicated multipliers and DSP blocks, and a variety of I/O options. It also includes a number of features that facilitate programming, such as a JTAG port and an integrated configuration device.


The XCV400E-6FG676C is suitable for a wide range of applications, such as medical imaging, industrial automation, digital signal processing, and embedded systems. It is also suitable for use in high-speed communications, such as Ethernet and USB.


In summary, the XCV400E-6FG676C is a mid-range FPGA chip with a wide range of features and suitable for a variety of applications. It has a capacity of 400K system gates and 6,000 logic cells, a power consumption of 1.2 watts, and is packaged in a 676-pin FCBGA. It includes features such as high-speed transceivers, built-in memory, dedicated multipliers and DSP blocks, and a variety of I/O options, and is suitable for use in medical imaging, industrial automation, digital signal processing, embedded systems, and high-speed communications.



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