XCVU29P-3FSGA2577E

The XCVU29P-3FSGA2577E is an FPGA (Field Programmable Gate Array) chip model manufactured by Xilinx, Inc. It is a high-performance, high-density, low-power FPGA device. This device is based on the 28nm UltraScale+ architecture, and is capable of delivering up to 29.3 Gbps of peak performance. It comes with 2.5 million logic cells, 18.6Mb of block RAM, and 1,824 DSP slices. It is also equipped with a wide range of transceivers, including 28G, 25G, and 10G transceivers.

The XCVU29P-3FSGA2577E is designed for use in a variety of applications, such as high-performance computing, networking, storage, and video processing. It is suitable for use in applications that require high-speed data transfer, such as 5G base stations, cloud computing, and machine learning. It is also suitable for use in applications that require high-speed data processing, such as machine vision, video analytics, and autonomous vehicles.

The XCVU29P-3FSGA2577E is a highly reliable and robust device, with an MTBF (Mean Time Between Failures) of over 1 million hours. It is also equipped with advanced security features, such as secure boot, secure configuration, and secure erase. Additionally, it is designed to operate over a wide temperature range, from -40°C to +105°C.

Overall, the XCVU29P-3FSGA2577E is a high-performance, high-density, low-power FPGA device, suitable for use in a variety of applications that require high-speed data transfer and processing. It is highly reliable and robust, and comes with advanced security features.