XCV1000E-6FG860C
XCV1000E-6FG860C ECAD Model
XCV1000E-6FG860C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Virtex®-E | |
| Package | Tray | |
| Number of LABs/CLBs | 6144 | |
| Number of Logic Elements/Cells | 27648 | |
| Total RAM Bits | 393216 | |
| Number of I/O | 660 | |
| Number of Gates | 1569178 | |
| Voltage - Supply | 1.71V ~ 1.89V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 860-BGA Exposed Pad | |
| Supplier Device Package | 860-FBGA (42.5x42.5) | |
| Base Product Number | XCV1000E |
XCV1000E-6FG860C Datasheet Download
XCV1000E-6FG860C Overview
The XCV1000E-6FG860C is a high-performance, low-power, field-programmable gate array (FPGA) chip from Xilinx. It is based on the Virtex-6 FPGA architecture and is designed for high-end applications such as embedded systems, signal processing, networking, and digital signal processing (DSP).
The XCV1000E-6FG860C has a total of 860K logic cells, with 1.5 million flip-flops and 10.8 million memory bits. It has a clock speed of up to 500MHz and a maximum power consumption of 15W. It also has a wide range of on-chip peripherals, such as I/O blocks, clock management, and memory controllers.
The XCV1000E-6FG860C is designed for applications that require high-performance, low-power solutions. It is ideal for use in embedded systems, signal processing, networking, and DSP applications. It is also suitable for applications such as video processing, medical imaging, and industrial automation.
The XCV1000E-6FG860C is designed for high-end applications and is a reliable, cost-effective solution for high-performance, low-power applications. It is a versatile, powerful, and reliable chip that can be used in a variety of applications.
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|---|---|---|
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