XCV2000E-6FG860C
XCV2000E-6FG860C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Xilinx

XCV2000E-6FG860C


XCV2000E-6FG860C
F20-XCV2000E-6FG860C
Active
IC FPGA 660 I/O 860FBGA
860-FBGA (42.5x42.5)

XCV2000E-6FG860C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCV2000E-6FG860C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 9600
Number of Logic Elements/Cells 43200
Total RAM Bits 655360
Number of I/O 660
Number of Gates 2541952
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 860-BGA Exposed Pad
Supplier Device Package 860-FBGA (42.5x42.5)
Base Product Number XCV2000E

XCV2000E-6FG860C Datasheet Download


XCV2000E-6FG860C Overview



The XCV2000E-6FG860C is a high-performance, low-power field-programmable gate array (FPGA) chip designed by Xilinx. It is made up of 860,000 logic cells and 2,000 distributed RAM blocks. It has a maximum operating frequency of up to 500 MHz and a total power consumption of only 4.5 W. It is also equipped with a number of advanced features, such as a high-speed transceiver, a high-density memory interface, and a high-speed serial interface.


The XCV2000E-6FG860C is suitable for a wide range of applications, including data center, storage, and communication systems. It can be used for high-speed data processing, high-bandwidth communication, and high-performance computing. It also provides a flexible platform for high-speed protocol processing, such as Ethernet, Fibre Channel, and InfiniBand.


The XCV2000E-6FG860C is a highly reliable and cost-effective solution for FPGA applications. It is designed to meet the most demanding requirements of today’s data center and communication systems. It is also suitable for applications where maximum performance and low power consumption are required. The chip also offers a wide range of advanced features, such as a high-speed transceiver, a high-density memory interface, and a high-speed serial interface.


In conclusion, the XCV2000E-6FG860C is a powerful and reliable FPGA chip that is suitable for a wide range of applications. It is designed to meet the most demanding requirements of today’s data center and communication systems. It offers a high degree of flexibility and performance, making it an ideal solution for high-speed data processing, high-bandwidth communication, and high-performance computing.



3,384 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote