XCV1600E-8FG860C
XCV1600E-8FG860C
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Xilinx

XCV1600E-8FG860C


XCV1600E-8FG860C
F20-XCV1600E-8FG860C
Active
IC FPGA 660 I/O 860FBGA
860-FBGA (42.5x42.5)

XCV1600E-8FG860C ECAD Model


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XCV1600E-8FG860C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 7776
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of I/O 660
Number of Gates 2188742
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 860-BGA Exposed Pad
Supplier Device Package 860-FBGA (42.5x42.5)
Base Product Number XCV1600E

XCV1600E-8FG860C Datasheet Download


XCV1600E-8FG860C Overview



The XCV1600E-8FG860C is a Field Programmable Gate Array (FPGA) chip produced by Xilinx. It is a mid-range device that is suitable for a wide range of applications. It is based on the Virtex-E architecture and is fabricated with a 0.15-micron process.


The XCV1600E-8FG860C has 8 million system gates and 860 user I/Os. It has up to 917 user-defined logic blocks, each with up to 8Kbits of embedded RAM. It also has a total of 8 embedded 18x18 multipliers and up to 1.5Mbits of distributed RAM. The device is also equipped with a dedicated clock management circuit, which allows for clock domain crossing and clock speed optimization.


The XCV1600E-8FG860C is suitable for a variety of applications, such as high-speed networking, embedded system designs, digital signal processing, and high-performance computing. It is also used in applications such as industrial automation, medical imaging, and automotive electronics.


The XCV1600E-8FG860C is built to be reliable and robust, and it is designed to be compatible with Xilinx's development tools, such as the ISE Design Suite and the Vivado Design Suite. It also supports the IEEE 1532 and IEEE 1149.1 standards, making it suitable for use in a wide range of industries and applications.



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