XCV100E-8BG352C
XCV100E-8BG352C ECAD Model
XCV100E-8BG352C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-E | |
Package | Tray | |
Number of LABs/CLBs | 600 | |
Number of Logic Elements/Cells | 2700 | |
Total RAM Bits | 81920 | |
Number of I/O | 196 | |
Number of Gates | 128236 | |
Voltage - Supply | 1.71V ~ 1.89V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 352-LBGA Exposed Pad, Metal | |
Supplier Device Package | 352-MBGA (35x35) | |
Base Product Number | XCV100E |
XCV100E-8BG352C Datasheet Download
XCV100E-8BG352C Overview
The XCV100E-8BG352C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx, Inc. It is based on the Virtex-E family of FPGAs and is designed for high-performance applications. It has a total of 8 million system gates, 352 I/O pins, and 8 Mb of on-chip RAM. It also features high-speed 3.2 Gbps serial transceivers, advanced clocking resources, and a low-power design.
The chip is well-suited for a wide range of applications, including high-speed networking, video and imaging, and signal processing. It can be used to implement complex algorithms, such as digital signal processing (DSP), image processing, and control systems. It can also be used to create custom logic designs, such as communication protocols, memory controllers, and digital signal interfaces.
The XCV100E-8BG352C has a wide range of features, including a high-speed, low-power design, a low-cost package, and a wide range of I/O options. It is also highly configurable, allowing users to customize the chip for their specific needs. It is also compatible with a wide range of development tools, making it easy to program and debug.
The XCV100E-8BG352C is an excellent choice for a wide range of applications, from high-performance networking to signal processing. It is also highly configurable, making it easy to customize for specific needs. It is a cost-effective solution for a variety of applications.
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