XCV300E-8BG352C
XCV300E-8BG352C
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Xilinx

XCV300E-8BG352C


XCV300E-8BG352C
F20-XCV300E-8BG352C
Active
IC FPGA 260 I/O 352MBGA
352-MBGA (35x35)

XCV300E-8BG352C ECAD Model


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XCV300E-8BG352C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 131072
Number of I/O 260
Number of Gates 411955
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 352-LBGA Exposed Pad, Metal
Supplier Device Package 352-MBGA (35x35)
Base Product Number XCV300E

XCV300E-8BG352C Datasheet Download


XCV300E-8BG352C Overview



The XCV300E-8BG352C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It is a mid-range device in the Virtex-E family of FPGAs, and is based on the Virtex-E architecture. It has 8 million system gates, 352 I/O pins and up to 1,600 Kbits of distributed RAM. It is capable of operating at speeds of up to 200MHz, and offers a wide range of features such as clock management, high-speed I/O and a large number of dedicated multipliers.


The chip's primary application areas include digital signal processing, embedded system design and high-speed communication systems. It is ideal for applications that require high levels of performance, low power consumption and high levels of integration.


The chip is available in a variety of packages, including a 352-pin BGA package. It can be used with a variety of development boards, including the Xilinx Platform Studio, which is a comprehensive development environment for creating and debugging designs.


In conclusion, the XCV300E-8BG352C is a powerful FPGA chip that is suitable for a wide range of applications. It offers a high level of performance, low power consumption and a wide range of features that make it an ideal choice for designers who need to create high-performance, low-power designs.



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