XCV300-6BG352C

XCV300-6BG352C is a low-power, high-performance FPGA chip model from Xilinx. It is designed to meet the needs of embedded applications requiring high-speed processing, efficient power management, and small form factor. The FPGA chip has a maximum power dissipation of 3.5W, a maximum operating temperature of 85°C, and a minimum operating voltage of 1.2V. It is packaged in a 352-pin BGA package with a die size of 6.8 mm x 6.8 mm.

The XCV300-6BG352C has a maximum of 300,000 logic cells and up to 8.5 Mbits of block RAM. It is equipped with high-speed transceivers, PLLs, and DSP blocks, and supports up to 24 user I/O pins. It is also equipped with a wide variety of I/O standards, including LVDS, LVCMOS, and SSTL.

The XCV300-6BG352C FPGA is suitable for a wide range of embedded applications, such as industrial automation, automotive, medical, and consumer electronics. It is also well-suited for applications requiring high-speed processing, such as video processing, image processing, and data processing. It is also suitable for applications requiring low-power operation, such as battery-powered and energy-efficient applications.

The XCV300-6BG352C FPGA is an ideal solution for embedded applications requiring high performance, low power, and a small form factor. It is reliable, cost-effective, and easy to use, making it an attractive choice for embedded applications.