XCV300E-6BG352I
XCV300E-6BG352I
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Xilinx

XCV300E-6BG352I


XCV300E-6BG352I
F20-XCV300E-6BG352I
Active
IC FPGA 260 I/O 352MBGA
352-MBGA (35x35)

XCV300E-6BG352I ECAD Model


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XCV300E-6BG352I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 131072
Number of I/O 260
Number of Gates 411955
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 352-LBGA Exposed Pad, Metal
Supplier Device Package 352-MBGA (35x35)
Base Product Number XCV300E

XCV300E-6BG352I Datasheet Download


XCV300E-6BG352I Overview



The XCV300E-6BG352I is a high-performance field-programmable gate array (FPGA) from Xilinx. It is a member of the Virtex-E family of FPGAs. This chip model is designed to provide high-performance, low-power solutions for a wide variety of applications.


The XCV300E-6BG352I is a 6-million-gate FPGA with 352 I/O pins. It is fabricated on a 0.18-micron CMOS process and has a power dissipation of 2.3 W. It is capable of operating at speeds up to 200 MHz, and is compliant with the JEDEC JESD-84-A standard. The device includes a variety of features such as enhanced clock management, dynamic reconfiguration, and advanced power-saving modes.


The XCV300E-6BG352I is suitable for a variety of applications, including high-performance embedded systems, high-speed networking, and digital signal processing. It is ideal for applications requiring high-speed, low-power operation, such as video processing, wireless communication, and medical imaging.


The XCV300E-6BG352I is a powerful, low-power FPGA designed for a variety of applications. It features a high-speed, low-power architecture, advanced clock management, dynamic reconfiguration, and advanced power-saving modes. Its wide range of features make it suitable for a variety of applications, including high-performance embedded systems, high-speed networking, and digital signal processing.



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